Featur / 特色
水密封能預因焊接或清理過程中的汙染物 Sealed against solder and cleaning procs contaminants
可有D保護物 D protection available
有PC腳和T腳 Thru-hole and surface mount models
使用面積小節省PCB上的空間 Compact size and all footprint save PCB space
Applications / 應用範圍
電信 Telecommunication 儀器.測試設備 Instrumentation 醫療設備 Medical equipment
SPECIFICATION
Mechanical life:30,000 make-and-break cycl.
Circuit:SPDT
Contact ristance:20mΩmax. initial @ 2-4VDC 100mA for both silver and gold plated contacts.
Insulation ristance:1,000MΩmin.
Dieletric strength:1,000 Vrms min.@sea level.
Degree of protection:IP 67
