1. RATING額定值:

DC30V0.5A

2. OPERATIONTEMPERATURERANGE使用溫度範圍：

-40~+70℃

3.PRERVATIVETEMPERATURERANGE：保存溫度範圍：

-40~+85℃

4. CONSTRUION DIMENSION結構尺寸：

Apply to the appended drawing：

合附加圖紙

ITEM項目

TT CONDITION測試條件

SPECIFICATION規格

5. ELERONICAL CHARAERISTICS.電氣性能.

5A

CONTA  RISTANCE

接觸阻

Being measured at 1KHz all current conta ristance meter.

在1KHZ小電流下測量.

100mΩ max

100毫歐以下.

5B

INSULATION

RISTANCE

絕緣阻

Measurements shall be made following application of DC1000V potential across terminals and across terminals and frame for 1 minute.

在端子之間和端子與殼之間加DC1000V條件下,持續1分鐘測量.

1000MΩ  min

1000兆歐以上.

5C

WITHSTAND

VOLTAGE

耐電壓

AC500V (50Hz or 60Hz) shall be applied across terminals and across terminals and frame for one minute

在端子之間和端子與殼之間加AC500V(50HZ或60HZ)條件下,持續1分鐘測量.

There shall be no breakdown.

無擊穿現象出現.

6. MECHANICAL CHARAERISTICS.機械性能.

6A

AIONPOWER

動作力

Aion Power 5-15N

動作力      5-15N

6B

TERMINAL STRENGTH

端子強度

A static force of 500gf being applied in one direion on the tip of terminal for 1 minute.

一個500克之靜負荷施加於端子頂部的一個方向持續1分鐘。

There shall be no sign of damage mechanically and elerically.

無任何跡象顯示機械及電氣性能之損壞.

7. DURABILITY.耐久性.

7A

SOLDERING TT.

可焊性試驗

The tip of the terminals shall be dipped 2mm in the solder bath at a temperature of 230&plun;5℃for2&plun;0.5sec.端子頂部被浸入焊錫池2mm深,溫度230&plun;5℃時間2&plun;0.5秒。

A new uniform coating of solder shall cover a minimum of90of the surface being immersed.浸入的部分90%以上表面將被錫覆蓋.

7B

RISTANCE          TO SOLDERING HEAT

耐焊接熱

Soldering area:t/2 of P.C.B thickns焊接面積：印刷基板的1/2厚度處

temperature:260&plun;5℃Sinkingtime: 5&plun;1S.焊接溫度：260&plun;5℃，焊接時間：5&plun;1秒。

No damage (elerical and mechanical)

無異常。（電氣、機械特性）